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Welcome to Supertechina (Shanghai) Electronic Co., Ltd. We would like to support you in flash storage products, industrial flash storage produccts and professional customized flash storage solution & service.

Super User

Super User

Half slim Sata III SSD
 
SSD is called Solid State Disk, consisted of nand flash chips and controllers. 

The interface, definition, functions, usage of SSD are same as that of traditional hard disk, so it has been widely used for laptop, desktop, tablet PC, army, Car, industrial control, video surveillance, network surveillance, network terminal, electricity, medical, airline, navigation and related fields etc..

SSD of Supertechina (Shanghai) Electronic Co., Ltd. adopted original and good die nand flash chips and latest controllers in order to assure the good compatibility. 

Supertechina half slim SATA III SSD supports 4GB to 512GB capacity based on consumer and industrial grade.


Specification:   
Capacity: 32GB/64GB/128GB/256GB/512GB
Dimension: 54(L)*39(W)*4(H)mm
Interface: Sata III
Form factor: Half slim
Nand flash chips kinds:  MLC/TLC
Nand flash chips grades:               Original and good die
ECC:  BCH ECC 66bits/1KB 
4KB random read and write IOPS 
Random IOPS 
Sudden power-off recovery support
S. M. A. R. T, NCQ, Trim and dynamic power management support
Static and dynamic wear-leveling
Bad block management algorithm
Compatibility: Windows 7 and above/Windows Vista/Windows XP/ Win2003 and Linux

Technical parameters: 
Voltage:  +5.0V (± 5%)
Operating Temperature:  0º C to 70º C
Storage Temperature: -40º C to 85º C
Humidity: 5% to 95%
Power Consumption(Varies by density): 1.21W(idle)           3.08W(active)
MTBF:  2 million hours
Vibration: 3.1G(2-500Hz)
Shock:   50G,11ms, half-sine wave
Data retention:  10 years

Certificate:
CE 
FCC 
ROHS 

Quality warranty term: 
5 years 

 

mSata III mini SSD
 
SSD is called Solid State Disk, consisted of nand flash chips and controllers. 

The interface, definition, functions, usage of SSD are same as that of traditional hard disk, so it has been widely used for laptop, desktop, tablet PC, army, Car, industrial control, video surveillance, network surveillance, network terminal, electricity, medical, airline, navigation and related fields etc..

SSD of Supertechina (Shanghai) Electronic Co., Ltd. adopted original and good die nand flash chips and latest controllers in order to assure the good compatibility. 

Supertechina mSATA III mini SSD supports 4GB to 512GB capacity based on consumer and industrial grade.


Specification:   
Capacity: 16GB/32GB64GB/128GB/256GB/512GB
Dimension: 26.8(L)*29.85(W)*3.85(H)mm
Interface: Sata III
Form factor: mSata mini
Nand flash chips kinds:  MLC/TLC
Nand flash chips grades:               Original and good die
ECC:  BCH ECC 66bits/1KB 
4KB random read and write IOPS 
Random IOPS 
Sudden power-off recovery support
S. M. A. R. T, NCQ, Trim and dynamic power management support
Static and dynamic wear-leveling
Bad block management algorithm
Compatibility: Windows 7 and above/Windows Vista/Windows XP/ Win2003 and Linux

Technical parameters: 
Voltage:  +5.0V (± 5%)
Operating Temperature:  0º C to 70º C
Storage Temperature: -40º C to 85º C
Humidity: 5% to 95%
Power Consumption(Varies by density): 1.21W(idle)           3.08W(active)
MTBF:  2 million hours
Vibration: 3.1G(2-500Hz)
Shock:   50G,11ms, half-sine wave
Data retention:  10 years

Certificate:
CE 
FCC 
ROHS 

Quality warranty term: 
5 years 

 

Industrial regular Micro OTG UDP USB2.0 flash drive chip

Supertechina UDP USB flash drive chip is very slim and short and can be assembled in very short and small USB flash drive cases. UDP USB flash drive chip is more stable in quality than traditional USB flash drive based on new production skills. Supertechina UDP USB flash drive chip can be customized for dimension and also choose different nand flash chips & controllers.


Specification:

Capacity:

4GB/8GB/16GB/32GB/64GB/128GB/256GB

Compatible with:

USB2.0/USB1.1

Nand flash chips kinds:

SLC/MLC/3D TLC

Nand flash chips grades:

Original and good die

Support:

USB HDD, USB ZIP dual boot mode

Function available:

Password protection function, auto-run function, bootable function, ReadyBoost function and data protection function

Compatible with:

Windows 98/ME, 2000/XP/Vista, Mac OS 9. X/X, Linux 2.4X or above versions

This smartphone OTG UDP USB flash drive chip must be with USB type C port and need to hardware support for OTG function of smart phone.

This smart phone OTG UDP USB flash drive chip can be used on table PC and auto phone system.

USB flash drive chip

OTG function

With USB type C interface

Smallest size

Dimension, nand flash chips and controllers can be customized

A new production method for USB flash drive

Flash chip is assembled on board together with controller, solution and accordingly software tackling

The assembled board can be used for whole USB flash drive function, also can be assembled in almost USB flash drive cases

Based on this production procedure, the defect ratio is pretty fewer and the quality is more stable than regular SMT production

Super thin and small size

Better water-proof and shock resistance function

Difficult fixed

Powered by USB bus directly

Hot plug & play

Shake protection


Technical parameter:
 

Erase cycles:

1,000,000 times

Minimum data retention:

10 years

Operating Humidity:

20% - 90%

Storage Humidity:

20% - 93%

Storage temperature:

-20ºC to +55ºC

Operating temperature:

-10ºC to +55ºC

Shock resistance:

1,000 g


Certificate:

CE

FCC

ROHS


Quality warranty term:
  

5 years

Micro UDP USB3.0 flash drive chip

Supertechina UDP USB flash drive is composed of UDP USB flash drive chip and USB flash drive cases. UDP USB flash drive chip is very slim and short, so it can be used in very short and small USB flash drive cases which is nice. UDP USB flash drive chips is more stable in quality than traditional USB flash drive based on new production skills.

Supertechina UDP USB3.0 flash drive chip choose latest good quality nand flash chips and controllers in order to assure stable highest writing and reading speed performance.


Specification:
USB flash drive chip
Suite for small and super slim USB flash drive case
Minimum length: 15.1 mm
Capacity: 8GB/16GB/32GB/64GB/128GB/256GB
USB interface standard:  - USB3.0
- Compatible with USB2.0 & USB1.1
Reading and writing speed: - up to 5Gbps
- 10 times speed than the speed of USB2.0
Full duplex transmission mode:         - Adopt a new bi-directional data transfer mode
- Communication parties can simultaneously send and receive data in order to transfer the data with higher speed
Characteristics: - A new production method for USB flash drive
- Flash chip is assembled on board together with controller, solution and accordingly software tackling
- The assembled board can be used for whole USB flash drive function, also can be assembled in almost USB flash drive cases
- Based on this production procedure, the defect ratio is pretty fewer and the quality is more stable than regular SMT production
- Super thin and small size
- Better water-proof and shock resistance function
- Difficult fixed
Color: Black & blue
Material: Plastic
Powered by USB bus directly
Hot plug & play
Shake protection
Electromagnetic wave protection
Support: USB HDD, USB ZIP dual boot mode 
Function available: Password protection function, auto-run function, bootable function, Readyboost function and data protection function
Compatible with: Windows 98/ME, 2000/XP/Vista, Mac OS 9. X/X, Linux 2.4X or above versions

Technical parameter: 
Erase cycles: 1,000,000 times
Minimum data retention: 10 years
Operating Humidity: 20% - 90%
Storage Humidity: 20% - 93%
Storage temperature:  -20ºC to +55ºC
Operating temperature:  -10ºC to +55ºC
Shock resistance: 1,000 g

Certificate:
CE
FCC
ROHS

Quality warranty term:  
5 years

Long DIMM DDR3 1600 8GB desktop ram

Supertechina ram memory used original and good die nand flas chips in order to assure the quality.


Specification: 
Memory capacity: 8GB
Memory type: DDR3 SDRAM
Memory clock speed:  1600Mhz
Transmission standards:        PC3-12800
Slot type: Long DIMM
Pin:  240pin
Features:  Unbuffered
Memory CAS latency: CL11
Memory CAS latency:  Dual
Date integrity check: Non ECC memory
Chipset: Hynix, NY, KST, SEC, MT, EPD etc.
Application: Desktop
Compatiblity: All motherborads of desktop

Technique parameters:
Clock Cycle Time(tCK): CL=4: 3ns (min.)/8ns (max. )
Row Cycle Time(tRC):  60ns (min. )
Refresh to Active:  127.5ns
Row Active Time (tRAS): 36ns (min. )/70,000ns (max. )
Single Power Supply of:  +1.5V (+/-0.1V)
Power: 2.125 W (operating per module)
UL Rating: 94 V to 0
Operating Temperature:  0 C to 55 C
Storage Temperature:  -55 C to +125 C

Certificate:
CE
FCC
ROHS

Quality warranty term:
5 years

 

Long DIMM DDR3 1600 4GB desktop ram

Supertechina ram memory used original and good die nand flas chips in order to assure the quality.


Specification: 
Memory capacity: 4GB
Memory type: DDR3 SDRAM
Memory clock speed:  1600Mhz
Transmission standards:        PC3-12800
Slot type: Long DIMM
Pin:  240pin
Features:  Unbuffered
Memory CAS latency: CL11
Memory CAS latency:  Dual
Date integrity check: Non ECC memory
Chipset: Hynix, NY, KST, SEC, MT, EPD etc.
Application: Desktop
Compatiblity: All motherborads of desktop

Technique parameters:
Clock Cycle Time(tCK): CL=4: 3ns (min.)/8ns (max. )
Row Cycle Time(tRC):  60ns (min. )
Refresh to Active:  127.5ns
Row Active Time (tRAS): 36ns (min. )/70,000ns (max. )
Single Power Supply of:  +1.5V (+/-0.1V)
Power: 2.125 W (operating per module)
UL Rating: 94 V to 0
Operating Temperature:  0 C to 55 C
Storage Temperature:  -55 C to +125 C

Certificate:
CE
FCC
ROHS

Quality warranty term:
5 years

 

Long DIMM DDR3 1333 2GB desktop ram

Supertechina ram memory used original and good die nand flas chips in order to assure the quality.


Specification: 
Memory capacity: 2GB
Memory type: DDR3 SDRAM
Memory clock speed:  1333Mhz
Transmission standards:        PC3-10600
Slot type: Long DIMM
Pin:  240pin
Features:  Unbuffered
Memory CAS latency: CL11
Memory CAS latency:  Dual
Date integrity check: Non ECC memory
Chipset: Hynix, NY, KST, SEC, MT, EPD etc.
Application: Desktop
Compatiblity: All motherborads of desktop

Technique parameters:
Clock Cycle Time(tCK): CL=4: 3ns (min.)/8ns (max. )
Row Cycle Time(tRC):  60ns (min. )
Refresh to Active:  127.5ns
Row Active Time (tRAS): 36ns (min. )/70,000ns (max. )
Single Power Supply of:  +1.5V (+/-0.1V)
Power: 2.125 W (operating per module)
UL Rating: 94 V to 0
Operating Temperature:  0 C to 55 C
Storage Temperature:  -55 C to +125 C

Certificate:
CE
FCC
ROHS

Quality warranty term:
5 years

 

SODIMM DDR3 1600 8GB laptop ram

Supertechina ram memory used original and good die nand flas chips in order to assure the quality.


Specification: 
Memory capacity: 8GB
Memory type: DDR3 SDRAM
Memory clock speed:  1600Mhz
Transmission standards:        NB3-12800
Slot type: SODIMM
Pin:  204pin
Features:  Unbuffered
Memory CAS latency: CL9
Memory CAS latency:  Dual
Date integrity check: Non ECC memory
Chipset: Hynix, NY, KST, SEC, MT, EPD etc.
Application: Laptop
Compatiblity: All motherborads of laptop

Technique parameters:
Clock Cycle Time(tCK): CL=4: 3ns (min.)/8ns (max. )
Row Cycle Time(tRC):  60ns (min. )
Refresh to Active:  127.5ns
Row Active Time (tRAS): 36ns (min. )/70,000ns (max. )
Single Power Supply of:  +1.2V (+/-0.1V)
Power: 2.125 W (operating per module)
UL Rating: 94 V to 0
Operating Temperature:  0 C to 55 C
Storage Temperature:  -55 C to +125 C

Certificate:
CE
FCC
ROHS

Quality warranty term:
5 years

 

SODIMM DDR3 1600 4GB laptop ram

Supertechina ram memory used original and good die nand flas chips in order to assure the quality.


Specification: 
Memory capacity: 4GB
Memory type: DDR3 SDRAM
Memory clock speed:  1600Mhz
Transmission standards:        NB3-12800
Slot type: SODIMM
Pin:  204pin
Features:  Unbuffered
Memory CAS latency: CL9
Memory CAS latency:  Dual
Date integrity check: Non ECC memory
Chipset: Hynix, NY, KST, SEC, MT, EPD etc.
Application: Laptop
Compatiblity: All motherborads of laptop

Technique parameters:
Clock Cycle Time(tCK): CL=4: 3ns (min.)/8ns (max. )
Row Cycle Time(tRC):  60ns (min. )
Refresh to Active:  127.5ns
Row Active Time (tRAS): 36ns (min. )/70,000ns (max. )
Single Power Supply of:  +1.2V (+/-0.1V)
Power: 2.125 W (operating per module)
UL Rating: 94 V to 0
Operating Temperature:  0 C to 55 C
Storage Temperature:  -55 C to +125 C

Certificate:
CE
FCC
ROHS

Quality warranty term:
5 years

 

SODIMM DDR3 1333 2GB laptop ram

Supertechina ram memory used original and good die nand flas chips in order to assure the quality.


Specification: 
Memory capacity: 2GB
Memory type: DDR3 SDRAM
Memory clock speed:  1333Mhz
Transmission standards:        NB3-10600
Slot type: SODIMM
Pin:  204pin
Features:  Unbuffered
Memory CAS latency: CL9
Memory CAS latency:  Dual
Date integrity check: Non ECC memory
Chipset: Hynix, NY, KST, SEC, MT, EPD etc.
Application: Laptop
Compatiblity: All motherborads of laptop

Technique parameters:
Clock Cycle Time(tCK): CL=4: 3ns (min.)/8ns (max. )
Row Cycle Time(tRC):  60ns (min. )
Refresh to Active:  127.5ns
Row Active Time (tRAS): 36ns (min. )/70,000ns (max. )
Single Power Supply of:  +1.5V (+/-0.1V)
Power: 2.125 W (operating per module)
UL Rating: 94 V to 0
Operating Temperature:  0 C to 55 C
Storage Temperature:  -55 C to +125 C

Certificate:
CE
FCC
ROHS

Quality warranty term:
5 years

 

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